QFP32 to DIP28 Test Seat QFP44 to DIP40 Test Seat AVR Programming Burning Seat 0.8 Spacing Zpaxo T-SIM7080G-S3 H606

QFP32/QFP44 to DIP28/DIP40 AVR Programming Test Socket 0.8mm

T-SIM7080G-S3 H606
$167.89
Sale price  $167.89 Regular price  $207.76
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QFP32 to DIP28 Test Seat QFP44 to DIP40 Test Seat AVR Programming Burning Seat 0.8 Spacing Zpaxo T-SIM7080G-S3 H606

QFP32/QFP44 to DIP28/DIP40 AVR Programming Test Socket 0.8mm

$167.89
Sale price  $167.89 Regular price  $207.76
ColorT-SIM7080G-S3 H606

QFP32/QFP44 to DIP28/DIP40 AVR Programming & Burning Test Socket — 0.8mm Pitch

Take your microcontroller programming and IC testing workflow to the next level with this precision QFP32 to DIP28 / QFP44 to DIP40 AVR Programming Burning Test Socket. Engineered with a 0.8mm pin pitch, this adapter seat provides a secure, reliable connection for flashing, burning, and testing AVR and compatible ICs — no soldering required. Ideal for electronics engineers, hobbyists, and professionals who demand repeatable, accurate results on the bench.

Key Features

  • Dual Compatibility: Supports QFP32 → DIP28 and QFP44 → DIP40 conversions in one compact tool.
  • 0.8mm Pitch Precision: Engineered for fine-pitch QFP packages, ensuring stable pin contact every time.
  • Zero-Insertion-Force (ZIF) Style Design: Easy chip loading and removal without bending or damaging pins.
  • AVR Programming & Burning Ready: Compatible with standard ISP programmers for AVR microcontrollers (ATmega, ATtiny, and similar series).
  • Durable Construction: High-quality socket contacts maintain conductivity through repeated insertions.
  • Breadboard & DIP Compatible: DIP28/DIP40 output footprint plugs directly into standard development boards and breadboards.
  • No-Solder Prototyping: Perfect for rapid prototyping, IC validation, and firmware development cycles.

What's in the Box?

  • 1 × QFP32/QFP44 to DIP28/DIP40 Programming Burning Test Socket (0.8mm pitch)

Specifications

Package Types Supported QFP32, QFP44
DIP Output DIP28, DIP40
Pin Pitch 0.8mm
Compatible MCUs AVR (ATmega, ATtiny series) and equivalents
Mounting Type DIP through-hole / breadboard compatible

Who Is This For?

Whether you're a seasoned embedded systems developer, a hardware prototyping enthusiast, or a student learning microcontroller programming, this test socket dramatically simplifies the process of burning firmware to surface-mount QFP chips without requiring a soldering iron. It bridges the gap between fine-pitch surface-mount devices and standard through-hole development platforms.

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Frequently Asked Questions

Q: What IC packages does this QFP to DIP test socket support?

A: This programming test socket supports QFP32 to DIP28 and QFP44 to DIP40 conversions, with a fine 0.8mm pin pitch, making it compatible with a wide range of AVR microcontrollers including ATmega and ATtiny series chips.

Q: Do I need to solder the IC to use this test socket?

A: No soldering is required. The test seat uses a clamping/ZIF-style mechanism to securely hold your QFP IC during programming or burning, allowing you to remove the chip cleanly after the process is complete — making it perfect for prototyping and repeated use.

Q: Is this socket compatible with standard AVR ISP programmers?

A: Yes. The DIP28/DIP40 output of this adapter is compatible with standard ISP (In-System Programming) programmers. Simply insert the adapter into your programmer or breadboard and load your QFP chip into the socket to begin firmware burning.

Q: How durable is this test socket for repeated use?

A: The socket contacts are manufactured from high-quality conductive materials designed to maintain reliable electrical contact through many insertion cycles, making it well-suited for both lab environments and regular production/testing workflows.

Production & Packaging Notice

To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.

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