ESP32-S3-DevKitC-1 WiFi BLE 5.0 Mesh Development Board

ESP32-S3-DevKitC-1 WiFi & BLE 5.0 Mesh Development Board

Take your embedded projects to the next level with the ESP32-S3-DevKitC-1 Development Board. Powered by Espressif's ESP32-S3 SoC, this versatile development kit combines dual-mode WiFi (2.4 GHz 802.11 b/g/n) and Bluetooth Low Energy (BLE) 5.0 with Mesh support, making it an ideal choice for IoT prototyping, smart home automation, wireless sensor networks, and more.

Whether you're an experienced embedded systems developer or an enthusiastic hobbyist, the ESP32-S3-DevKitC-1 offers the performance, connectivity, and flexibility to bring your ideas to life quickly and reliably.

Key Features

• ESP32-S3 SoC: Dual-core Xtensa LX7 processor for high-performance computing
• WiFi 2.4 GHz: 802.11 b/g/n support for seamless wireless connectivity
• BLE 5.0 + Mesh: Long-range, low-energy Bluetooth with mesh networking capability
• Multiple Memory Options: Available in N8R2 and N16R8 configurations (Flash/PSRAM)
• Antenna Options: Choose from onboard PCB antenna, IPEX antenna connector, or pre-welded external antenna variants
• Expansion Board Option: Compatible expansion board variant available for rapid prototyping
• SMD Package: Compact, surface-mount design for easy integration into custom hardware
• Arduino & ESP-IDF Compatible: Works with popular development frameworks and IDEs
• Customizable: Supports custom firmware and application development

Available Variants

• ESP32-S3-N16R8 (standard)
• ESP32-S3 Expansion Board
• N16R8 with IPEX Antenna
• N16R8 with IPEX Seat
• N16R8 Chip Antenna
• N16R8 IPEX Weld / Weld Antenna
• ESP32-S3-N8R2 (standard)
• N8R2 with IPEX Seat / IPEX Antenna

Ideal Use Cases

• IoT device prototyping and development
• Smart home and automation systems
• Wireless sensor networks
• Edge AI and machine learning applications
• Wearable technology projects
• Robotics and embedded control systems

Related Products You May Like

Pair your development board with quality components and accessories from our store:

• Round Aluminum Wire 1mm–3mm | DIY Jewelry Making Wire — great for custom enclosure wiring and prototyping
• Glow in the Dark Natural Stone Round Beads | DIY Jewelry Making — fun add-on for creative sensor-embedded wearable projects

Learn more: EPA guidance on lithium-ion battery handling

Frequently Asked Questions

Q: What memory configurations are available for the ESP32-S3-DevKitC-1?

A: The ESP32-S3-DevKitC-1 is available in two main memory configurations: N8R2 (8MB Flash + 2MB PSRAM) and N16R8 (16MB Flash + 8MB PSRAM). The N16R8 variant is ideal for more memory-intensive applications such as edge AI inference, image processing, or large firmware images.

Q: What antenna options does the ESP32-S3-DevKitC-1 support?

A: This development board is available in several antenna configurations to suit your project needs: onboard PCB/chip antenna, IPEX connector (for attaching an external antenna), IPEX with seat, and pre-soldered (weld) antenna versions. External antenna variants typically offer improved range in environments with signal interference.

Q: Is the ESP32-S3-DevKitC-1 compatible with Arduino IDE and ESP-IDF?

A: Yes! The ESP32-S3-DevKitC-1 is fully compatible with both the Arduino IDE (via the ESP32 Arduino core) and Espressif's native ESP-IDF framework. This gives you the flexibility to choose the development environment you are most comfortable with, whether you are a beginner or an advanced developer.

Q: What is BLE Mesh and what can I do with it?

A: BLE Mesh (Bluetooth Low Energy Mesh Networking) allows multiple BLE devices to communicate with each other in a many-to-many topology, rather than simple one-to-one pairing. With the ESP32-S3's BLE 5.0 Mesh support, you can build distributed wireless networks where dozens of devices share data — perfect for smart lighting, building automation, asset tracking, and large-scale sensor deployments.

Production & Packaging Notice

To maintain high stock availability and fast shipping times, our items are sourced from multiple verified manufacturing facilities. While the core quality, materials, and product specifications remain identical, you may notice slight variations in the packaging design, manufacturing origin, or the wording of the printed instructions.